Stainless steel vacuum chamber with blue plasma viewport

Thin Film Deposition Systems · Korvus Technology

HEX Series – Modular Thin Film Deposition

Highly modular thin-film deposition. A platform that grows with your research — add sources, stack chambers and reconfigure at any point.

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Overview

One system. Many deposition techniques.

The HEX Series is a family of highly modular PVD systems. Magnetron sputtering, electron-beam, low-temperature and thermal evaporation sources can be combined in a single compact platform.

Available in three sizes — HEX, HEX-L and HEX-XL — for samples from 4" to 12".

Future-proof

Designed to evolve.

Add sources anytime

Expand the system as new deposition needs arise.

Stackable chambers

Double chamber volume by stacking.

Sputter up or down

Detachable plates allow either orientation.

Adjustable geometry

Change source-to-substrate distance and angle.

Compact footprint

Full research capability in a benchtop-scale frame.

Research-ready

Configured for materials, semiconductor, optical and PV research.

Specifications

Three sizes, one philosophy.

	HEX	HEX-L	HEX-XL
Sample size	4"	6"	12"
Max. sources	3	6	6
Magnetron size	2"	2" or 3"	3" or 4"
Chamber volume	12 L / 24 L stacked	50 L / 100 L stacked	86 L / 172 L stacked
Base pressure*	5×10⁻⁷ mbar	<5×10⁻⁷ mbar	<5×10⁻⁷ mbar

*Ultimate base pressure measured on factory-tested systems.

Source modules

Choose your deposition techniques.

FISSION — Magnetron Sputtering Source

For 2", 3" and 4" targets, with DC, RF, HiPIMS and pulsed-DC sputtering options.

ORCA — Low Temperature Evaporation

Precise organic evaporation from 50–600 °C, with glovebox integration available for the HEX Series.

TAU — Electron Beam Evaporation

High-accuracy, sub-monolayer evaporation with four material pockets for co-deposition.

TES — Thermal Boat Evaporation

A robust, cost-effective thermal boat source for depositing standard metals.

Module names, descriptions and images: Korvus Technology.

Product information referenced from Korvus Technology.

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