NB INSTRUMENT
2000 & 2550 PVD Systems
Flexible, automatic batch-load sputtering systems designed around different loading and wafer-handling requirements.
One process module. Two ways to load.
Nordiko's 2000 and 2550 series share a common process module. The 2000 can cycle to atmosphere for batch loading or use a single-shot load lock.
Pairing the module with a wafer-handling platform and vacuum cassette load lock creates the 2550 configuration.
Configured for the process at hand.
Flexible cathode population
Choose four 200 mm cathodes or six 150 mm cathodes.
Power choices
Each cathode may be configured for RF diode, DC, RF magnetron or DC/RF magnetron operation.
Substrate formats
The rotating table can be configured to accommodate different substrate formats.
Geometry control
Adjust table height to optimise the process and rotate substrates from 2 to 30 rpm.
2000 / 2550 configuration.
| Series | 2000 batch load / 2550 vacuum cassette load-lock wafer handling |
|---|---|
| Process module | Common to both series |
| 2000 loading | Atmospheric batch cycling or single-shot load lock |
| 2550 loading | Wafer-handling platform with vacuum cassette load lock |
| Cathode options | Four 200 mm or six 150 mm cathodes |
| Cathode operation | RF diode / DC / RF magnetron / DC-RF magnetron |
| Substrate table | Rotating, height-adjustable; accepts varied substrate formats |
| Rotation speed | 2–30 rpm |
A flexible thin-film platform.
- Batch sputter deposition
- Wafer-based thin-film processing
- Research and process development
- Physical vapour deposition workflows
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